SMART MANUFACTURING STANDARDS
The SEMI Standards Program brings together experts to exchange ideas and work towards developing globally accepted technical standards.
Starting from the SECS (SEMI Equipment Communications Standard) and GEM (Generic Model for Communications and Control of Manufacturing Equipment) standards, and more recently with Equipment Data Acquisition standards, the SEMI Standards Program has served as the platform for development of advanced automation standards enabling Smart Manufacturing across the microelectronics industry.
Today, the Information & Control and Automation Technology Global Technical Committees continue to develop new Standards, examining topics such as energy conservation, traceability, automation of back-end processing, and manufacturing equipment communication interfaces for printed circuit boards and related industries.
SEMI SMART MANUFACTURING STANDARDS
COMMUNICATION PROTOCOLS
SEMI E4-0418 — Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
SEMI E5-1217 — Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)
SEMI E37-0413 — High-Speed SECS Message Services (HSMS) Generic Services
SEMI E39-0703 — Object Services Standard: Concepts, Behavior, and Services
EQUIPMENT CONTROL
SEMI E30-0418 — Specification for the Generic Model for Communications & Control of Manufacturing Equipment (GEM)
SEMI E40-0813 — Standard for Processing Management
SEMI E84-1109 — Specification for Enhanced Carrier Handoff Parallel I/O Interface
SEMI E87-1017 — Specification for Carrier Management (CMS)
SEMI E90-0312 — Specification for Substrate Tracking
SEMI E94-0314 — Specification for Control Job Management
EQUIPMENT DATA ACQUISITION & PROCESS DIAGNOSTICS
SEMI E120-0414 — Specification for the Common Equipment Model (CEM)
SEMI E125-0414 — Specification for Equipment Self Description (EqSD)
SEMI E128-0414 — Specification for XML Message Structures
SEMI E132-1015 — Specification for Equipment Client Authentication and Authorization
SEMI E134-0414 — Specification for Data Collection Management
SEMI E138-0217 — Specification for XML Semiconductor Common Components
SEMI E164-0414 — Specification for EDA Common Metadata
SEMI E179-0320 — Specification for Protocol Buffers Common Components
ADVANCED ANALYTICS AND PROCESS CONTROL
SEMI E116-0518 — Specification for Equipment Performance Tracking
SEMI E126-0708 — Specification for Equipment Quality Information Parameters (EQIP)
SEMI E133-0318 — Specification for Automated Process Control Systems Interface
SEMI E157-0611 — Specification for Module Process Tracking
DATA MANAGEMENT
SEMI E151-1211 — Guide for Understanding Data Quality
SEMI E160-1211 — Specification for Communication of Data Quality
SEMI E172-0118 — Specification for SECS Equipment Data Dictionary (SEDD)
SEMI E173-0415 — Specification for XML SECS-II Message Notation (SMN)
SURFACE-MOUNT TECHNOLOGY ASSEMBLY LINES AUTOMATION [SMT-ELS]
SEMI A1 — Specification for Horizontal Communication (HC) Between Equipment for Factory Automation System
SEMI A1.1 — Specification for Media Interface for A Horizontal Communication (HC) Between Equipment
SEMI A2 — Specification for Surface Mount Assembler Smart Hookup (SMASH)
AUTOMATION FOR ADJACENT INDUSTRIES
SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI)
SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
SEMI PV2 - Guide for PV Equipment Communication Interfaces (PVECI)
Future Topics to Support Smart Manufacturing
Data security
Big data integration
Virtual Metrology
Predictive Analytics
Digital Twin
Supply chain integration
Data and IP partitioning
Resources - www.semi.org
